Our technology is patented under the following patent reference:
Invention “WO 2009113856 (A1) – INTEGRATED MICRONEEDLE ARRAY AND A METHOD FOR MANUFACTURING THEREOF”.
Based on the above application, patents have been granted in:
| • United States |
– 8,603,384 – 10,413,711 |
| • Japan |
– 5517956 – 5948308 |
| • China |
– 200980117052.4 – 201310656222.4 |
| • Europe | – 2262722 |