Intellectual Property

Our technology is patented under the following patent reference:
Invention “WO 2009113856 (A1) - INTEGRATED MICRONEEDLE ARRAY AND A METHOD FOR MANUFACTURING THEREOF ”.
Based on the above application, patents have been granted in:

•      United States -     8603384
•      Japan

-     5517956

-     5948308

•      China

-     200980117052.4

-     201310656222.4

•      Europe -     2262722


One more patent application is pending at present.